Direct Plated Copper (DPC) ceramic substrate is a magnetron sputtering of copper metal on a highly insulated ceramic substrate.
The circuit pattern is scribed on the ceramic substrate by means of activated sputtering and exposure development. The electroplating method can not only make the metal and ceramic materials of different properties have good adhesion, but also the line is not easy to fall off, and the line position can be more accurate. The advantage of narrower line spacing. Mainly used in high brightness and high power LED, microwave wireless communication and semiconductor equipment.
